UZ-37/02 Leaded Solder Paste
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Details : Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting . Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move. Excellent soldering performance can complete a good wetting in differentparts Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement. Better ICT Test performance will not appear the false judgement.