Soldering Pastes Dealers in Shastri Puram, Agra

• Melting Point: 151°C-189°C
• Alloy: Sn64-Bi 35-Ag1
• Powder Shape: ≥95 %
• Flux Content: Moderate temperature, high cost performance.

Details Good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing . Can complete continuous printing for a long time almost without collapse after printing for a few hours small viscosity change SMD Components are not easyto move. Excellent soldering performance can complete a good wetting in different parts Less residue after soldering transparent appearance high insulation resistance do not corrode the PCB and meet the disposable requirement. Better ICT Test performance will not appear the false judgement.