UZ-36/04 Leaded Solder Paste
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Details Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting . Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move. Excellent soldering performance can complete a good wetting in differentparts Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement. BetterICTTest performance willnot appearthe false judgement.