GFET-S12 for Sensing applications
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100 Piece (MOQ)
FEATURES Growth method: CVD synthesis Polymer assisted transfer Chip dimensions: 10 mm x 10 mm Chip thickness: 675 μm Number of GFETs per chip: 27 Gate oxide thickness: 90 nm Gate oxide material: SiO2 Dielectric Constant of the SiO2 layer: 3.9 Resistivity of substrate: 1-10 Ω.cm Metallization: Au contacts Graphene field-effect mobility: >1000 cm2/V.s Dirac point: <50 V Minimum working devices: >75 %
GFET-S12 For Sensing Applications
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