Electronic Circuit Boards Dealers in Dooravani Nagar, Bangalore

• Features: Over current protection , Compact design, Flawless finish .
• Item Code: MV-1465

• Number Of Layers: Multilayer
• Board Thickness: 0.4mm to 3.2mm
• Testing Point: BBT
• Minimum Line Spacing: 0.50 mm
• Base Material: FR4

• Voltage: 250 V
• Usage/Application: Fixture Testing
• Brand Name: NCN
• Phase: Single Phase

Inverters, Ups, Batteries

Backed by our team of dexterous professionals, we have emerged a proficient Supplier of Printed Circuit Boards from Bangalore. The Printed Circuit Boards we make available are manufactured in compliance with set industrial norms. Stringent quality-tests ensure that only defect-free Printed Circuit Boards reach the buyers. Bulk orders of the Printed Circuit Boards are delivered by us within the stipulated time. Buyers can obtain the Boards at nominal rates.   Capability :TTM Technologies has the following technical capabilities to support you for your PCB requirements. Faster turnaround Prototype / Pilot lot quantities / Higher volumes Multilayer PCBs up to 60 layers Defense / Aerospace, ITAR, MIL-PRF-31032, MIL-PRF-55110, MIL-PRF-50884, AS9100, NADCAP Rigid, Flex, Rigid-Flex boards Large format backplanes, panel sizes up to 28” x 49” Maximum Boards Thickness: 0.300” Aspect Ratio: 20:1 RoHS Compliant Trace & Space: 2.5/3 mil (External) & 2/2.5 mil (Internal) Minimum Core Thickness: 1 mil Minimum dielectric thickness: 1.5 mil Minimum mechanical drill size: 4 mil Minimum micro-via hole size: 3 mil Blind and Buried Via HDI Technology - flip chip, micro BGA, Types I, II, & III microvias Back Drilling and via structures to minimize signal noise Embedded Resistors / Capacitance Edge Plating High aspect ratio plating Counter sink Edge Milling Wire Bondable Soft Electrolytic Gold Metal core (Aluminum, Copper) Controlled Impedance and Differential Impedance Via filling (conductive & non-conductive) Multiple surface finishes available for lead-free assembly Thick back panels High Temperature material High Frequency material High-speed materials including Rogers, Megtron, 4000-13EP, etc. Heavy copper up to 12 ounces Bonded heat sinks Via in pad FLAT-WRAP™ Technology, Next Gen SMV® RF/Microwave PCBs Thermal Management – Copper Core, STABLCOR®

reflow ovens, Semiconductor, Automotive, final assembly automation

multilayer pcbs, Keyboards

Inverters

electronic wave soldering machines, solar cell hot plate, laminating machines

digital integrated circuits, arrays, transducers, thermistors, Sensors

Printed Circuit Boards, Electrical Goods, electrical coil

Inverters

Printed Circuit Boards, Circuit Board

pcb wet process machinery

Inverters, Home Lights

Inverters, Generator, Solar Lighting, Solar Water Heater, Water Heater

cable assemblies, Printed Circuit Board

Circuit Boards

inverter circuit boards, External DVD Drive

Printed Circuit Board

speedtronic circuit boards