cmos camera module
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Data Acquisition Board
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Best Deals from Electronic Circuit Boards
Electronic Training Boards
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We provide our clients a wide range of Electronic Training Boards that are fabricated as per the client’s requirements and are available with varied specifications.
Single PCB Assembly
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ARINC
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KEY FEATURES: CAN ISO 11898-1 protocol compatibility 11-bit and 29-bit CAN IDs Bit rates from 10 kbit/s up to 1 Mbit/s supported Receive buffer (64 CAN messages) Complete access to CAN error counters Programmable error warning limit Error code capture register Error interrupt for each CAN bus error Arbitration lost interrupt with detailed bit position Single-shot transmission (no re-transmission) Listen only mode (no acknowledge, no active error flags) Automatic bit rate detection (software supported bit rate detection) Acceptance filter (4-byte code, 4-byte mask) Self-reception mode (reception of ‘own’ messages) Busload measurement MULTIPLE HIGHER LEVEL PROTOCOLS: CANopen Master- and Slave-Stack J1939 ARINC825
emi shielding
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emi shielding, vehicle decals, Automotive Dials, Control Panel Stickers
Printed Circuit Boards
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Backed by our team of dexterous professionals, we have emerged a proficient Supplier of Printed Circuit Boards from Bangalore. The Printed Circuit Boards we make available are manufactured in compliance with set industrial norms. Stringent quality-tests ensure that only defect-free Printed Circuit Boards reach the buyers. Bulk orders of the Printed Circuit Boards are delivered by us within the stipulated time. Buyers can obtain the Boards at nominal rates. Capability :TTM Technologies has the following technical capabilities to support you for your PCB requirements. Faster turnaround Prototype / Pilot lot quantities / Higher volumes Multilayer PCBs up to 60 layers Defense / Aerospace, ITAR, MIL-PRF-31032, MIL-PRF-55110, MIL-PRF-50884, AS9100, NADCAP Rigid, Flex, Rigid-Flex boards Large format backplanes, panel sizes up to 28” x 49” Maximum Boards Thickness: 0.300” Aspect Ratio: 20:1 RoHS Compliant Trace & Space: 2.5/3 mil (External) & 2/2.5 mil (Internal) Minimum Core Thickness: 1 mil Minimum dielectric thickness: 1.5 mil Minimum mechanical drill size: 4 mil Minimum micro-via hole size: 3 mil Blind and Buried Via HDI Technology - flip chip, micro BGA, Types I, II, & III microvias Back Drilling and via structures to minimize signal noise Embedded Resistors / Capacitance Edge Plating High aspect ratio plating Counter sink Edge Milling Wire Bondable Soft Electrolytic Gold Metal core (Aluminum, Copper) Controlled Impedance and Differential Impedance Via filling (conductive & non-conductive) Multiple surface finishes available for lead-free assembly Thick back panels High Temperature material High Frequency material High-speed materials including Rogers, Megtron, 4000-13EP, etc. Heavy copper up to 12 ounces Bonded heat sinks Via in pad FLAT-WRAP™ Technology, Next Gen SMV® RF/Microwave PCBs Thermal Management – Copper Core, STABLCOR®
digital integrated circuits
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digital integrated circuits, arrays, transducers, thermistors, Sensors
AUDIO IC CHIP BOARD
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AUDIO IC CHIP BOARD
Sensor Data Acquisition Controller Board
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Sensor Data Acquisition Controller Board, optical isolator
Inverters
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Inverters, Ups, Batteries
terminal board
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terminal board, TEFC Squirrel Cage Induction Motors, Laminated Yoke Dc Motor
Inverters
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Inverters, Exide Solar Batteries, Exide Inverter Batteries