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We are ranked amongst the foremost firms that is engaged in manufacturing and supplying a wide range of Electronic Ceramics Component. The offered Electronic Ceramics Component is manufactured using superior quality raw material and sophisticated technology in line with industry norms. Our provided Electronic Ceramics Component is available in various designs and sizes as per the demands of our clients. Apart from this, offered Electronic Ceramics Component is available at pocket friendly prices.
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Heat Sink
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wifi module
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The ESP8266 WiFi Module is a SOC with integrated TCP/IP protocol stack that can give any microcontroller access to your WiFi network. This module is capable of either hosting an application or offloading all Wi-Fi networking functions from another application processor. Each ESP8266 module comes pre-programmed with an AT command set firmware. You can simpy connect this with your microcontroller and connect to Wi-Fi right out of the box. Connecting with Arduino is much simpler and works similar to a Wi-Fi shield except that this is in a much smaller package. The module is an extremely cost effective board with a huge supporting community.ESP8266 WiFi Module also has a powerful enough on-board processing and storage capability that allows it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during runtime. The high degree of on-chip integration allows for minimal external circuitry. The module supports APSD for VoIP applications and Bluetooth co-existance interfaces and contains a self-calibrated RF allowing it to work under all operating conditions without any external RF parts.There is a lot of information on ESP8266 over the web provided by amazing community support. If you are thinking of IOT, think ESP8266 modules.Note: The ESP8266 Module is not capable of 5-3V logic shifting and will require an external Logic Level Converter. Please do not power it directly from your 5V dev board. FEATURES 802.11 b/g/n Wi-Fi Direct (P2P), Soft-AP Integrated TCP/IP protocol stack Integrated TR switch, balun, LNA, power amplifier and matching network Integrated PLLs, regulators, DCXO and power management units Power down leakage current of
Heat Sink
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AMD HEAT SINK WITH FAN DKM-7D52A-A6GP DESCRIPTION Manufacturer: Cooler MasterP/N: DKM-7D52A-A6-GPCompatible Sockets: AMD Socket AM2/AM3/939/940/754
electronic assembly
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