HDC Technologies Inc. Kaggadasapura, Bangalore, Karnataka

Backed by our team of dexterous professionals, we have emerged a proficient Supplier of Printed Circuit Boards from Bangalore. The Printed Circuit Boards we make available are manufactured in compliance with set industrial norms. Stringent quality-tests ensure that only defect-free Printed Circuit Boards reach the buyers. Bulk orders of the Printed Circuit Boards are delivered by us within the stipulated time. Buyers can obtain the Boards at nominal rates.   Capability :TTM Technologies has the following technical capabilities to support you for your PCB requirements. Faster turnaround Prototype / Pilot lot quantities / Higher volumes Multilayer PCBs up to 60 layers Defense / Aerospace, ITAR, MIL-PRF-31032, MIL-PRF-55110, MIL-PRF-50884, AS9100, NADCAP Rigid, Flex, Rigid-Flex boards Large format backplanes, panel sizes up to 28” x 49” Maximum Boards Thickness: 0.300” Aspect Ratio: 20:1 RoHS Compliant Trace & Space: 2.5/3 mil (External) & 2/2.5 mil (Internal) Minimum Core Thickness: 1 mil Minimum dielectric thickness: 1.5 mil Minimum mechanical drill size: 4 mil Minimum micro-via hole size: 3 mil Blind and Buried Via HDI Technology - flip chip, micro BGA, Types I, II, & III microvias Back Drilling and via structures to minimize signal noise Embedded Resistors / Capacitance Edge Plating High aspect ratio plating Counter sink Edge Milling Wire Bondable Soft Electrolytic Gold Metal core (Aluminum, Copper) Controlled Impedance and Differential Impedance Via filling (conductive & non-conductive) Multiple surface finishes available for lead-free assembly Thick back panels High Temperature material High Frequency material High-speed materials including Rogers, Megtron, 4000-13EP, etc. Heavy copper up to 12 ounces Bonded heat sinks Via in pad FLAT-WRAP™ Technology, Next Gen SMV® RF/Microwave PCBs Thermal Management – Copper Core, STABLCOR®