Snack Machine Dealers in Peenya, Bangalore

We are offering ceramic wafer laser scrubbing machine. The new generation of laser scribing machine is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0. 5 mm thick maximum), etc. , in industries of electronics, semiconductor and solar energy, etc. It is designed by experts with professional features, such as excellent beam quality and power stability, precise cnc worktable and efficient auto cooling system. Some of the most important parts are manufactured in uk, us and germany.

Backed by our in-depth industry expertise, we offer a qualitative range of Fiber Silicon Wafer Laser Scribing Machine to our clients at reasonable prices. These Fiber Silicon Wafer Laser Scribing Machines are capable of scribing cutting various silicon wafer, solar cell and ceramic wafer. It is also capable of scribing cutting thin metal sheet (~0.5 mm thick maximum). We also meet the bulk demand of pour clients within the committed time frame. Features Excellent beam quality and system reliability High-speed scribing (up to 300 mms), very low-defective index Compact design, dual protective systems Precise CNC worktable Friendly man-machine interface and simple software operation

• Weight: 100-500kg
• Color: Grey
• Voltage: 220V, 380V
• Automatic Grade: Automatic
• Driven Type: Electric
• Application: Noodles Maker
• Power: 1-3kw

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