Computer Parts & Components Dealers in Kingsway Camp, Delhi

Since the mainstream of the new IC's chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package's soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

• Type: Graphic Card
• Condition: New
• Warranty: 2yrs
• Size: 123
• Brand Name: Graphic card
• Material: good
• Thickness: yes
• Interface Type: yes

EVGA GeForce GTX 1080 Ti K | NGP | N GAMING 11GB GDDR5X Technology iCX 11G-P4-6798KR

• Type: Computer Motherboard, Laptop Motherboard
• Certification: CE Certified, ISO 9001:2008
• Voltage: 12VDC, 24VDC
• Condition: New, Old
• Memory Type: DDR3, SDRAM
• Chipset: North Bridge Intel GM45 Chipset, South Bridge Intel ICH9 Chipset
• Color: Black, Blue, Green
• Graphic Card: Integrated, Non-Integrated

• Type: BGA Chips
• Voltage: 220 V
• Application: Industrial
• Frequency: 50 Hz
• Grade: Manual
• Minimum Order Quantity: 1 Piece

Aware about all laptop Bios Setting learn how to Create windows Partition & Formatting installation of different windows. Learn to make Driver Backup & Restore it. Learn to Repair all Windows and Driver File Lern How recover Data Different types of Virus Problem Learn USB Port and LAN Port Problem Solve Camera Failure Problem

• Feature: This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and proprietary software attached to it.

Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

DVD Recorder, 5.1 channel dvd player, Portable Dvd Player, Portable Radio

microprocessor, Laboratory Instruments

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BIOS Programmer

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Uniscope Xc2 CDMA GSM Dual Sim 16GB 2GB RAM - FOR TATA CDMA

Computer Parts, Computer Monitor, Computer Laptop

Computer Hardware

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Computer Processors, Computer Ram

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BIOS Programmer

Computer Cabinets, Hardware Products, Keyboards, SMPS, Ups