Fieldbus Components Dealers in Nehru Place, Delhi

• Defense: Hand-held field device
• Automotive: Audio, navigation, infotainment GPS

The HandyLink™ interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15,000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.

• Brand Name: EXFO
• Weight: 0.9 kg (2.1 lb)
• Model Name/Number: MCM-GbE
• SIP registration support per port: 1800 (3600) per second
• Reset button: Two (one per port)
• Width: 41 mm (1.6 in)

• Digital IO Modules: IC Chip
• Interface IC: IC Components
• Controller IC: IO CHIP

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