I. T. Solutions Yamuna Vihar, Delhi

We are offering rework station. zm?|r5860c main features 1?aadopt liner slide which makes x?ay?az axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability?g 2?ahigh definition touch screen (taiwan) , pcl control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function?g 3?athere are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is ir preheating, temperature controlled within ?}3 ??; top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time; the third ir heater can be adjusted the power consumption; 4?aoffer all kinds of hot-air nozzle, it can rotate 360???gwith magnet, easy to install and change, customized is available; bottom ir heater ensure an even heat for pcb board; 5 ?achoose imported high-precision k-type thermocouple, closed loop control and automatic temperature compensation system, combined plc module for the precision control of temperature. 6. Use a v-groove equipped with a flexible fixture for pcb positioning to protect the pcb from deformation when heated or cooled, and it can rework for any bga package size; 7?apowerful cross-flow fan rapidly cool the pcb board to improve efficiency; also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly?g 8.after finishing desoldering & soldering, there is an alarming and alarming in advance?g 9?ace certificate, with emergency stop and automatic power-off protection device when abnormal accident happens?gwith a double over-heating protection control?g 10?accd vision system, accurate judgments on the melting process during the bga soldering and desoldering, provide critical vision.

Brand Name : BGA

We are offering zm-r5860 bga rework station. product description main charming points: 1: main and submain chipset heaters adopt hot air flow heaters, can heat chipset bothsides(front&back), ensure get good work effect, especially for complex motherboard 2: ir preheater for preheating pcbmotherboard efficiently. Ensure heating evenly and fully during desoldering or soldering processes 3: cool fan cool pcbmotherboard immediately once the heating finished, ensure no deformation happens, protect the pcb or motherboard(especially good for expensive motherboard) effectively. 4: 50blank groups for uploading your own profiles, recycle usage. 5: touch screen for operation, two manage interface: humized design; 6: one set of irregular pcb holders and screwers for supporting special or super small motherboard repair 7: top head can move by loose scewers or tighen. Safe enough for positioing usage

Brand Name : BGA

We are offering rework station. Features: 1. This machine has the strong and perfect function selection, with eight temperature waves in the memory software, you can select the right temperature wave according to the solderunsolder request. 2.intelligent temperature wave heating, can achieve the solderunsolder automatically. 3. Three-dimensional adjustable lamp body, use laser light, suitable for unsoldering any-angle components. 4. Pid intelligent temperature control can avoid the ic damage due to the fast or uninterrupted warming up. 5. This machine has a super hot melt system, use infrared welding technology which is developed independently, heat is easy to pierce and distribute evenly, can suit for a variety of computer, notebook, play station’s bga components, especially in a northbridge southbridge chipset of computer. 6. Friendly human-machine operation interface, perfect lcd display, you can watch the whole repairing process very clearly. 7. Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the t-890 to be easily bench positioned, transported or stored. Technical parameters complete machine power 1500w rated voltage and frequency ac 110-230 v 6050hz infrared lamp body power 300 w preheating chassis power 1200 w working bench size 320 x 330 mm infrared lamp body heating size 60 x 60 mm preheating chassis preheating size 245 x 260 mm preheating chassis temperature range 0 -350 size 316mm x 410mm x 290mm net weight 9.3 kg main parts welding table main body 1 infrared lamp body 1 portal frame 2 power line 1 user manual(compact disc) 1

We are offering t-870a rework station. 1. Features: 1. Adopt infrared weld technology which independent exploration. 2. Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco. 3. Easily operate. Just need one day training. Can operation this machine. 4. Don't need weld tools. This machine can weld all the component of 35x35-50x50mm. 5. This machine has 800w heating system. Widely to 240x180mm. 6. Infrared heating don't have sirocco flow. Don't impact perimeter small component. Can suitable for the entire component, especially micro bga component. 7. Definitely can satisfy the computer, the notebook, the electricity swims and so on the bga sealing offrepairs to request; specially especially suits to the computer north and south bridge.

Brand Name : BGA

We are offering welder machine. Parameter working voltage : ac220v 50hz output power: 800w temperature: 100-350 technical parameters compare with t860,irda welder add a rework 936 and a 936 switch, more concenient than before. 1boot. -check the power source,wind the plug. -turn on the power source.dont use until pass check.pand will display enactment value.when last time used. -installation the repair shell.fix the line on the strip rack.screw the light system height.keep 20-30mm between light and welder machine. -according to measurement of welder piece.proprictily screw temperature.from60-350.when you strip -15mm piece.choice temperature 240-300.when you strip 25, 25mm piece.choice temperature 300-350.the temperature come up to 350.the light system will shoot straightly.please pay more attention to yourself control time.avoid burn out. â�¤screw focus.the light system smallest diameter is 15mm .the biggest is 30mm.normally keep 20-30mm. -turn on the two switches.they control warm-up plate and light system. 2 dismantle and weld regulate temperature , make the chip focus -after suitable for timing, the tin is clicked and melted, take out the chip. 3 weld the chip clean the pad coating help solder flux (should not thick too , can have first more thin ) and soldering tin ball -wait to help the solder flux to volatilize into the flux, heat and totally melt to the tin ball, place correctly with the clip, aim at the chip to weld into the position. -£936 searing-iron.open the swich and enactment temperature. caution! 1.after use, imprison power immediately, make sure the light body cooling down, and place it in safety. After turning off the power switch 2.keep the blowing way without hindered, the light body is clean. 3.the support in good time is polished with the oil to lead the post, focus 4.disconnect the plug when you dont use the it for a long time. 5. Operate carefully, take care gw: 8kg carton size: 46x34x30.5cm effective weld size: 18x18mm 1. Adopt infrared weld technology which independent exploration. 2. Use infrared heat, it is easy to cut through, heat proportion piercing tradition weld machine with sirocco. 3. Easily operate. Just need one day training.can operation this machine. 4. No need weld tools,it can weld all the component of 15x15-25x25mm. 5. This machine has 650w heating system.widely to 80x120mm. 6. Infrared heating no have sirocco flow. Don't impact perimeter small component.can suitable for all of the component,especially micro bga component.

We are offering stencils set. complete 295 pieces

We supply and export a wide variety of Plain Polyester Film Rolls. Our exclusive range of Plain Polyester Film Rolls can be further customized by our vendors, at the specification of the clients. Our Plain Polyester Film Roll is available in different colors and can be embellished according to the requirement of the Clients. We offer optimum quality Plain Polyester Film Rolls at market leading prices. Specialty : Superior qualityMoisture resistantFine sealing

Model Release Date Processors Supported Fabrication process (nm) FSB/HT Frequency (MHz) Memory Max. memory AGP SATA PATA Sound Features Notes nForce2 2002 Athlon XP, Sempron, Athlon, Duron 333MHz, 266MHz, 100MHz DDR 3GB AGP8X 4 Ports AC'97 NVAPU (MCP-T) optional GeForce 4 MX IGP optional dual channel memory interface nForce2 400 2003 Athlon XP, Sempron, Athlon, Duron 400MHz, 333MHz, 266MHz, 100MHz DDR 3GB AGP8X 2x 1.5Gbit/s (MCP-S, MCP-Gb) 4 Ports AC'97 NVAPU (MCP-T) single channel memory interface RAID (MCP-RAID, MCP-Gb) gigabit LAN (MCP-Gb) nForce2 Ultra 400 2003 Athlon XP, Sempron, Athlon, Duron 400MHz, 333MHz, 266MHz, 100MHz DDR 3GB AGP8X 2x 1.5Gbit/s (MCP-S, MCP-Gb) 4 Ports AC'97 NVAPU (MCP-T) dual channel memory interface RAID (MCP-RAID, MCP-Gb) gigabit LAN (MCP-Gb) [edit]nForce3 Model Release Date Processors Supported Fabrication process (nm) FSB/HT Frequency (MHz) Memory AGP SATA PATA Sound Features Notes nForce3 250 September 23, 2003 Athlon 64, Sempron Socket 754 HT 800MHz DDR AGP8X 4 Ports 1.5Gbit/s 4 Ports AC'97 Gb variant includes gigabit LAN nForce3 Ultra June 1, 2004 Athlon 64 FX, Athlon 64 X2, Athlon 64, Sempron Socket 939 HT 1GHz DDR AGP8X 4 Ports 1.5Gbit/s 4 Ports AC'97 [edit]nForce4 [edit]For AMD processors Model Release Date Processors Supported Fabrication process (nm) FSB/HT Frequency (MHz) Memory PCI-Express SLI SATA PATA Sound Features Notes nForce4 October, 2004 Athlon 64 FX, Athlon 64 X2, Athlon 64, Sempron Socket 939, 754 HT 1 GHz DDR2 / DDR 1.0 4 Ports 1.5 Gbit/s 4 Ports AC'97 nForce4 Ultra October, 2004 Athlon 64 FX, Athlon 64 X2, Athlon 64, Sempron Socket 939 HT 1 GHz DDR2 / DDR 1.0 4 Ports 3 Gbit/s 4 Ports AC'97 Same chipset as nForce4 SLI but with some resistors removed thus disabling SLI nForce4 SLI October, 2004 Athlon 64 FX, Athlon 64 X2, Athlon 64, Sempron Socket 939, 754 HT 1 GHz DDR2 / DDR 1.0 SLI x8 4 Ports 3 Gbit/s 4 Ports AC'97 nForce4 SLI X16 November, 2005 Athlon 64 FX, Athlon 64 X2, Athlon 64, Sempron Socket 939 HT 1 GHz DDR 1.0 SLI x16 4 Ports 3 Gbit/s 4 Ports AC'97 [edit]For Intel processors Model Release Date Processors Supported Fabrication process (nm) FSB/HT Frequency (MHz) Memory PCI-Express SLI SATA PATA Sound Features Notes nForce4 Ultra January 17, 2006 Pentium D, Pentium 4, EE, Celeron D LGA 775 1066 MHz DDR2 1.0 4 Ports 3 Gbit/s 4 Ports HDA nForce4 SLI XE January 17, 2006 Pentium D, Pentium 4, EE, Celeron D LGA 775 1066 MHz DDR2 1.0 SLI x8 4 Ports 3 Gbit/s 4 Ports HDA nForce4 SLI April 5, 2005 Pentium D, Pentium 4, EE, Celeron D LGA 775 1066 MHz DDR2 1.0 SLI x8 4 Ports 3 Gbit/s 4 Ports AC'97 nForce4 SLI X16 Pentium D, Pentium 4, EE, Celeron D , Core2 (unofficial, some MB), LGA 775 1066 MHz DDR2 1.0 SLI x16 4 Ports 3 Gbit/s 4 Ports AC'97 [edit]nForce 500 Series Model Release Date Processors Supported Fabrication process (nm) FSB/HT Frequency (MHz) Memory PCI-Express SLI SATA PATA Sound Features Notes nForce 500 Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 / DDR x16: 1 slot x1: 3 slots 4 Ports 1.5 Gbit/s 4 Ports AC'97 nForce 500 Ultra Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 / DDR x16: 1 slot x1: 3 slots 4 Ports 3 Gbit/s 4 Ports AC'97 nForce 500 SLI Athlon 64 X2, Athlon 64 Socket AM2 HT 1 GHz DDR2 / DDR x8: 2 slots x1: 3 slots SLI x8 4 Ports 3 Gbit/s 4 Ports AC'97 nForce 520 LE Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 x16: 1 slot x1: 2 slots 2 Ports 3 Gbit/s 2 Ports HDA nForce 520 Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 x16: 1 slot x1: 3 slots 4 Ports 3 Gbit/s 2 Ports HDA nForce 550 March 7, 2006 Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 x16: 1 slot x1: 4 slots 4 Ports 3 Gbit/s 2 Ports HDA nForce 560 Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 x16: 1 slot x1: 3 slots 4 Ports 3 Gbit/s 2 Ports HDA nForce 560 SLI Athlon 64 X2, Athlon 64 Socket AM2 HT 1 GHz DDR2 x8: 2 slots x1: 2 slots SLI x8 4 Ports 3 Gbit/s 4 Ports AC'97 nForce 570 Ultra Athlon 64 X2, Athlon 64, Sempron Socket AM2 HT 1 GHz DDR2 x16: 1 slot x1: 4 slots 6 Ports 3 Gbit/s 2 Ports HDA Asus PEG Link nForce 570 LT SLI Athlon 64 X2, Athlon 64 Socket AM2 HT 1 GHz DDR2 x8: 2 slots x1: 2 slots SLI x8 4 Ports 3 Gbit/s 2 Ports HDA nForce 570 SLI March 7, 2006 Athlon 64 X2, Athlon 64 Socket AM2 HT 1 GHz DDR2 x16: 1 slot x8: 1 slot x1: 4 slots SLI x8 6 Ports 3 Gbit/s 2 Ports HDA nForce 590 SLI March 7, 2006 Athlon 64 FX, Athlon 64 X2, Athlon 64 Socket AM2 HT 1 GHz DDR2 x16: 2 slots x8: 1 slot x1: 6 slots SLI x16 6 Ports 3 Gbit/s 2 Ports HDA

Type : chip

We offer wide range of Laptop Mother Boards for all reputed brands. The random access memory, central processing unit, disk drives, hard drive and optical drives are all plugged into interfaces on the motherboard. Our range of laptop motherboards is offered at most effective cost.

Our Metalized Polyester Film Rolls remain in use for years and are high resistance to moisture. With perfect sealing, our Metalized Polyester Film Rolls retain their quality even when exposed to adverse conditions.

Our Metalized Polyester Film Rolls remain in use for years and are high resistance to moisture. With perfect sealing, our Metalized Polyester Film Rolls retain their quality even when exposed to adverse conditions.

We offer wide range of Laptop Screen for our clientswhich is widely applicable for industrial and business applications, we offer these screens in various sizes. Having crystal clear resolutions, these laptop screens are highly user-friendly

We are offering Laptop Accessories etc.These Accessories are available for different brands and enjoy a wide compatibility. Offered at leading market prices, our range of laptop Accessories includes all kinds of Keyboards, Speakers , Laptop bga, led screens , hinches , display cable , etc.

We are engaged in the exporting and supplying of BOPP Polyester Film Rolls in different sizes. These BOPP Polyester Film Rolls are procured from trusted vendors and are widely used in making carry bags and in packaging. These BOPP Polyester Film Rolls are widely appreciated for their excellent resistance to heat and water proof packaging. These BOPP Polyester Film Rolls are highly durable and remain in use for a long time. Specialty : Heat resistant Water-proof highly durable Resistant to wear & tear

We are offering bga rework station - (zx-c2) etc. Available with us is this bga rework station zx-c2 is designed keeping in mind the convenience of the user. Widely acknowledged by the clients, the bga rework station zx-c2 provided by us is the best choice available in the markets. features : with controller and button to control the machine manual. Adjust height of top heater by hand, with vacuum pen to pick bga manual after reflow.top and bottom heater use hot air, 3rd heater use ir to preheat whole pcb board. Bottom heater can adjust up and down to support the bottom of bga.top and bottom heater can set 8 segments heating, cooling and constant temperature, save 10 groups temperature profile, ir heater start heating at the same time with top and bottom heater.three heater use independent pid control, heating process is more accurate and uniform.bottom heater equipped with support, can adjust up and down to support bottom side of pcb board to prevent deformation.there is support on top of ir heater to prevent pcb deformation.cross-flow fan to cool pcb board after remove and reflow to ensure welding effect. specifications pcb thickness≤l540 x w 450mmtamperature control0.5~3mmpcb positioningk sensor & closed looptemperature controloutersub (bottom) heaterinfrared - 2400wmain (top) heaterhot air - 800w+800wpower usedsingle phase - 220v, 50/60hz, 4.2kvamachine dimensionl570 x w560 x h560mmweigth of machineapprox. 39kgs

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. Ball-grid array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.