Soldering Machine Dealers in Timarpur, Delhi

• Weight: 100-1000kg, 1000-2000kg, 2000-3000kg, 3000-4000kg, 4000-5000kg
• Color: Black, Brown, Grey
• Voltage: 110V, 230V, 450V
• Condition: New, Used
• Application: Bga Rework
• Power: 1-5kw, 10-15kw, 15-20kw, 20-25kw, 5-10kw
• Power Source: Battery, Diesel, Fuel, Solar
• Warranty: 1year, 2years, 5years
• Current: Alternating Current

• Weight: 180 g
• Total length: 250mm
• Temperature Range: 50 to 600 deg C
• Station Power consumption: 30 W
• Air Flow: 1-9 (5 to 115L/min)
• Frequency: 50 HZ

• Weight: 79KG
• Country of Origin: china
• Voltage: 220
• Application: Bga Rework
• Power Source: Electronic
• Power: AC 220V±10%，50HZ/60HZ
• Automatic Grade: Semi Automatic
• Condition: New
• Color: Grey
• Brand Name: Semark ZM
• Size: L685*W633*H850mm
• Temperature Control: K-type thermocouple closed-loop control with accuracy up to ±3℃
• Total Power: Max 5300W
• Positioning: V-grove, PCB support
• PCB Size: Max 415x370mm Min 6x6mm
• BGA Chip: Max 60x60mm Min0.6x0.6mm

smd rework stations, cartridge refilling machine, Bga Reballing Kit

Choose imported high - precision materials (temperature sensor, PLC, heater) to control the BGA disordering & soldering procedures precisely. Top & bottom temperature areas heat independently and it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at same time. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and proprietary software attached to it. Choose imported high - precision thermocouple to detect the top/bottom temperature precisely. Top & bottom heating can be controlled independently by the temperature graphs. A cross - flow fan cools rapidly to protect the PCB from deformation when welding. BGA Machine S909 Specification: Total Power: 5200 W Top Heater: 800 W Lower Heater: 1200 W Bottom infrared pre-heater: 3000 W Power Supply: AC 200V 50/60 HZ  

• Feature: This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and proprietary software attached to it.

Advance BGA Machine suppliers Company in Delhi India. Since the mainstream of the new IC's chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, Bga reballing machine.BGA package's soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced.BGA MACHINE suppliers Company in Delhi India. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

coil soldering machine, Coil Winding Machine, Coil LCR testing machine