Wafer Frame Coating Thickness Measurement System
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Coating thickness gauge for electroplating and electroless coatings XDV-U or X-Ray Fluorescence Tester is available in various technical specifications. These are widely used for non-destructive analyses and measurements of coating thickness on very small components and structures, even with complex coating systems.Applications Measurements on very small flat components and structures such as printed circuit boards, contacts or lead frames Analysis of very thin coatings, e.g., gold/palladium coatings of 0.1 ¼m (0.004 mils) Measurement of functional coatings in the electronics and semiconductor industries Determination of complex multi-coating systems Automated measurements, e.g., in quality control
Film Thickness Measurement System
700,000 Per Piece
1 Piece (MOQ)
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Film Thickness Measurement System
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Film Thickness Measurement System
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We developed, in cooperation with leading manufacturers, a wide range of optical thin-film metrology instruments from high-precision sophisticated ellipsometry and reflectometry systems (spectroscopic, fast single wavelength and Imaging) for research and production applications to low-budget reflectometers for variety of applications, Ellipsometry is a nondestructive and highly sensitive optical measurement technique used to analyze thin-layer stacks.
Film Coating Thickness Measuring System
750,000 Per Piece
1 Piece (MOQ)
Film Thickness Measurement System
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Film Thickness Measurement System
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Film Thickness Measurement System, ZSS- Series Solar Simulator
Film Thickness Measurement System
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Film Thickness Measurement System, silicon wafer