Rigid Flex PCB Dealers

• Material: Fiber Glass
• Thickness: 3mm
• Color: Green
• Board Type: Single Side
• Usage/Application: Electronic Industry
• Number Of Layers: 2 Layers

• Category: Optical Connectivity
• Mode: Singlemode, Multimode, Hybrid
• Routing: Standard, 3D
• Defense: Avionics Electronic warfare systems

As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane™ Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane™ Circuitry provides high-density routing on a flexible, flame-resistant substrate. As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane™ Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane™ Circuitry. 3D FlexPlane™ routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate. Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP™), High Density Blind Mate MT (HBMT™ ), Blind Mate LC (BLC™ ) and Blind Mate SC (BSC™ ) Optical Backplane Connector Systems can be used to connect FlexPlane™ Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available.

• Category: Optical Connectivity
• Mode: Singlemode, Multimode, Hybrid
• Routing: Standard, 3D
• Features: Diverse substrate size, shape and packaging ,Compatible with mass and discrete-fiber terminations

As telecommunications and networking technology advances, systems increasingly call for optical backplanes with high-fiber counts and cross-connect systems. Molex's FlexPlane™ Optical Backplane Circuitry provides a manageable means of fiber routing from card-to-card or shelf-to-shelf. Designed for versatility, standard FlexPlane™ Circuitry provides high-density routing on a flexible, flame-resistant substrate. As applications grow more demanding, available real estate on PCBs shrinks and adequate airflow becomes a vital part of design requirements. 3D FlexPlane™ Optical Backplane Circuits provide almost a 50% substrate size reduction compared to standard FlexPlane™ Circuitry. 3D FlexPlane™ routes the fiber on multiple stacked substrates to achieve a compact routing area while the standard routes flex circuits on a single substrate. Telecommunication and networking modules often need to be quickly replaced on backplanes without disrupting the entire system. System architects also need design flexibility to meet the particular demands of each application. Blind Mate MTP (BMTP™), High Density Blind Mate MT (HBMT™ ), Blind Mate LC (BLC™ ) and Blind Mate SC (BSC™ ) Optical Backplane Connector Systems can be used to connect FlexPlane™ Optical Flex Circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle or in a logical pattern to meet specific requirements. Direct or fusion-spliced terminations are available.

Rigid flex pcb high reliability flexible printed circuits on polyimide substrates using advanced manufacturing processes. We specialize in single and double-sided circuits; multi-layer and Metal core PCB, Flexible Keypad and PCB and provide customized PCB to our customer as well as clients.Whether your circuit needs are for flat flexible cable, flexible printed circuits boards, rigid flex circuits, rigid flex circuits or other. We have the capability to meet your needs. We offer value added services that will assist you with bringing your flexible circuit design into reality.

• Material: Steel
• Copper Thickness: 1/3 Oz - 2 Oz
• PCB Thickness: 0.05-2.5 mm
• Minimum Punched Hole: 0.9 mm
• Layer: 1-6 Layers

We Offer Rigid flex PCBs. Layer: 2 Material: FR4 Thickness: 1.2mm Width: 0.2mm (minimum)

• Feature: Consume less power, Corrosion proof, Top notch quality

• Maximum Board Size: 600mm X 520mm
• Maximum Number Of Layer: 2 Layer (DSPTH)

Flexible printed circuit boards are used to make interconnections in systems that have no room for rigid PC boards. Flex circuits are bendable and lightweight and are used in applications where the circuit is bent or flexed in two or more planes in the assembly or installation process.

• Material: Polyimide
• Copper Thickness: 1 Oz
• Country of Origin: Made In India
• Brand Name: Shara
• Laminate Thickness: 0.5 mm
• Min Annular Ring: 0.10 mm
• Min Hole Size: 0.1 mm

Specifications Supported: a. IPC-600 b. IPC-6013 c. Customer specific 2. Product types: a. Single-Sided with & without stiffeners b. Double-Sided with & without stiffeners c. Multi-Layer Pure-Flex with & without stiffeners d. Multi-Layer Rigid-Flex

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