Advance Technologies Kaushambi, Ghaziabad, Uttar Pradesh

Base Material (Laminates) FR1, CEM1, FR4 Glass Epoxy, Aluminum Based Copper Clad, High Tg material From 0.2 to 3.2 mm thick From 17 to 105 micron copper PCB Finish CNC Drilled PISMOBC (Photoimagiable Solder Mask Over Bare Coper) HAL (Tin Laed or Lead Free), OSP, ENIG V-Grooving CNC Routing Silk Screen: White, Black, Yellow Solder Mask Color: Green, Red, Blue, White, Black Peelable Mask Conductive Carbon Selective Gold Platting Edge Platting Finished Copper: 35 to 140 microns Quality Control Universal Bare Board Testers (BBT) Fixtureless Flying Probes (FBT) Dedicated Bare Board Testers Automatic Optical Inspection (AOI) Microsection Unit Copper Thickness Measurement Standard Followed IPC-A-600, IPC-6011, IPC-6012 class 2 Pre - Engineering Facilities Lazor Photoplotter CAD-CAM Gerber editing, penalization, Reverse Engg. Limitations Minimum Spacing: 6 mil (0.15 mm) Minimum Track Width: 6 mil (0.15 mm) Minimum hole dia (finished): 10mil (0.25 mm)