Nanosemi Technology & Systems Pvt. Ltd. Sector 63, Noida, Uttar Pradesh

Power : 30W

The Model VAF Furnace System is designed by RCH Associates to perform annealing, alloying or sintering of substrate films that are sensitive to residual oxidation such as refractory and composite metals. The system includes a moving element that traveses the outside of the main vacuum process chamber. The components of the processing system generally include: Main quartz process tube with vacuum flange at the load port. The flange includes a line that is connected to a vacuum pump and a gas injection port. An inert, noble or forming gas delivery system. A fast response element that is mounted to a guide track, liner bearing system that is motor driven. An array of fans to cool the outer wall of the main chamber tube. A pumping system that includes 2 isolation valves. One valve is used to isolate the chamber from the vacuum pump to allow high flows of purge gas during cooling. The second valve allows the vacuum pump to evacuate the chamber.       The process steps for a typical vacuum annealing process are: With the element retracted from covering the main chamber, the substrates are then inserted. This allows the substrates to be loaded at room ambient temperature. The main chamber is sealed and vacuum is drawn to evacuate all residual oxygen from the process environment and to outgas any residuals. The element, which is preheated, then traveses to cover the main chamber and raise the temperature of the substrates to annealing targets. Substrates remain at-temperature for the designated time. After timed-annealing, the element traverses to uncover the main chamber. When the element is retracting, the fans are turned on to air-cool the outer wall of the chamber tube. Simultaneoulsy, a high volume of gas is delivered to the inside of the chamber to cool the substrates. The combination of these methods rapidly returns the substrates to room ambient temperature. The substrates are then retracted from the main chamber.

SYSKEY PECVD system is a single process chamber Plasma enhanced chemical vapor deposition system using advanced plasma technology. It is designed based on SEMI and ISO standards for 12 inch semiconductor wafer processing, especially suitable for the deposition of silicon oxide / silicon nitride and CNT, DLC, etc thin films.  The system is configured with a parallel-plate capacitor type plasma reactor, a high quality vacuum system, and electronic control system for fully automatic process control.

Diffusion furnaces are designed for optimum temperature accuracy and stability. Enclosed in a unitized, rugged and thermally insulated cabinet structure, up to 4 heating elements are packaged for easy maintenance and extended service life.   Furnace Cabinet:   Unitized structural steel assembly Hinged, locking and removable element access doors Thermally insulated enclosure paneling High temperature Urethane coating Easy-to-adjust element alignment supports Cabinet overtemperature interlock sensor Leveling pads and optional seismic brackets   Toxic Gas Scavenger:   Stainless steel construction Vents gases and heat from process tube or chamber Indepently adjustable exhaust draw per tube-level Cantilever closure or manual door sealing per tube-level LPCVD flange and gas line fitting mounting scheme Differential pressure gauge to monitor exhaust draw   Air-to-water Heat Exchanger:   Used to vent heated air from furnace cabinet top HVAC control of furnace room Water-cooled, high efficiency radiator Air baffle paneling to direct air flow through cabinet Exhaust fan module for air exhaust draw   Power Distribution:   Located within base of furnace cabinet Encloses transformers, terminals and wire bussing Encloses temperature controls and contactors/breakers Easy accessibility to components Pull down panels for easy access to control modules EMO safety controls Reduncant overtemperature interlock per element zone   Element Kits:   Elements         Low temperature range element 350 to 900oC             Mid temperature range element 600 to 1200oC         High temperature range element 600 to 1350oC          +/- 0.5oC tolerance 600 to 1350oC range         +/- 1.0oC tolerance 350 to 600oC range             Vacuum formed high purity alumina insulation         Stainless steel shroud         Helical windings with captive spacing Control and overtemperature TC spikes per zone TC wire channel TC holding and alignment clips Energy Kits         High purity alumina vestibule blocks         NEXTEL soft collars         Stainless steel capture rings, plates and collars                      Power Controls:   High efficiency digital SSR/SCR firing circuitry Power control and circuit protection with EMO NEC-grade wiring Easy accessibility to components Main and control power disconnect contactors Individual element power contactors and resets Illuminated power indicators Redundant overtemperature interlocks 208, 380, 415, 480VAC main power, 50 or 60Hz

The ASTRA Control System provides integrated control of all diffusion and LPCVD furnace system parameters. ASTRA is Ethernet-based using distributed control via a high-powered, tube-level microcomputer and intuitive, process-logical software. All ASTRA operations are accomplished through graphical and animated, touch screen access. Comprehensive data acquisition, logging and graphing provide real-time assessments for optimum process management. Features Microcomputer (per tube-level)              Intel Core2Duo Processor.         DDRII RAM.         High capacity hard drive.         Flash drive data transfer.         Printer module.         Microsoft Exel compatible. Touch Screen High-resolution.              Fab-friendly touch even with cleanroom gloves.   Temperature              Multiple control loops.             Spike TC, profile TC or cascade control.              Auto profile or custom PID.              Programmable temperature tolerancing.         NIST offset program.         Data acquisition, logging and graphing.         0.1oC control resolution.   Gas, Fluids and Vacuum         Multiple MFC control loops.         Programmable flow tolerance monitor and alerts.         Fault redirects with abort or branch.         Interface programming of peripheral components.         Comprehensive LPCVD vacuum control monitoring.         LPCVD auto leak-test protocol.         Hardware and firmware safety interlock.   Loading                 Intelligent motor control.         Programmable motion and feedback logic.         End-of-travel sensing with next-step function.         Over-travel sensing with fault redirects.   Power         120/220/240VAC, 50 or 60 Hz with UPS   Example States and Functions         Operation and programming.         Navigate.         Password management and access rights.         Recipe editing.         Temperature parameters.         Gas/fluid parameters.         Vacuum paramters.         Loading parameters.         Step times and event response editing.         Calibrations.         Alarm fault redirects.         Hardwire relay logic and firmware interlocks.   Benefits   Precise control of temperature, gas and fluid flow, vacuum and loading parameters for optimum process performance and repeatability.   Intuitive programming and operation through graphical touch screen access for easy training and operation.   Tube-level microcomputer for high speed and masterful data management, which results in optimized yields and process tracking.    Distributed control with full safety interlocks for gas flow, vacuum, temperature and loading, which provide safe, reliable operation.   Optimized temperature control with divisible cascading and auto profiling to setup and maintain optimum temperature parameters.   User permissions protocols assure only qualified personnel can access programming, recipes and parameters.   Comprehensive alerts, alarms, redirects and monitors for all parameters. Provides instant responses, reporting and recording of anything that affects process perfomance or safety.   Full maintenance accessibility with integral trouble-shooting and calibrations. Provides data for maintenance with no additional maintenance computer required.   Advanced LPCVD control and monitoring functions for sustained process repeatability.   On-screen keyboard for easy data entry.   Lot tracking/run history for multiple lots per run. Allows recipe tracking of wafers and wafer lots.   Retrofitable to most any furnace brand or model. Modernizes all control attributes at low cost.    Optional ASTRA Host System. Provides centralized factory recipe management, downloading, data acquisition and logging for up to 99 tube-levels.