Marshal Laboratories Pvt Ltd Narhe, Pune, Maharashtra

Room temperature electroelss nickel stable alkaline formulation uniform coverage abs plastic plating undercoat.

New generation room temperature plating process, no additional cost of heating exceptionally good thrwoing power no need of seperate jigging, plating jigs of nickel bath can continue for chromium plating most suitable for abs plastic plating plant hard deposit.

Marshal laboratories offers high temperature stable process suitable for Rack and barrel operation. The deposits are bright and suitable for wide range of passivations.

Marshal laboratories offer eco-friendly zinc plating system which is also good for achieving high corrosion resistance and uniform thickness deposition, because of it's unique honeycomb type microstructure. The same system can be used for zinc-fe deposition.

Marshal laboratories offers chromate conversion coating for electroplated zinc deposits which enhances the corrosion resistance of the deposit layer. The specialty formulation imparts thick chromate layer with uniform brightness to thedeposit. The formulation are in the concentrate form and reduces the replenishment quantity. Marshal laboratories offer eco-friendly trivalent passivation systems and so also traditional hexavalent chromium formulations.

Oilpetroleum industrial vales and other components. all components exposed to atmosphere computers printed circuit boards

We are offering medium phosphorus.

We are offering low phosphorus.

Room temperature electroelss nickel stable alkaline formulation uniform coverage abs plastic plating undercoat.

Cleans pcb holes, removes drilling debries, finger marks and other impurities. Prepares hoels for catalyst by imparting charges because of unique quaternery molecule

Single component additive for electrolytic copper plating bath. Deposit ductile copper. Enahnce the thrwoing power and uniform plating.

Room temperature electroless copper bath, deposits uniform , void free copper uniformly.

Organic formulation dip for preventing the copper surface from tarnishing.

Bright uniform tin electrodepostion. Compact plating, protecting the copper circutary without overhang

Ammonical etching solution replenisher. Maintains the copper content and speed of operations, ph of solution. Maintains the solution sludgefree

Organic dryfilm stripper suitable for spray application. Does not attack on tin brightness. Removes dry film quickly leaving copper surface ultra clean for fine etching.

Deposit hard gold with a very effective speed of depsotion (1 microns in 3:30 mins). Hard depsoit with low contact resistance. Suitable for barrel applications in case of phosphor bronze pin connectors.

Special en system designed for immersion gold deposition. Operates at lower temp range.

Offers, adherent, bright gold deposit thickness around 0.1 microns.