Bond-007 Fungicide
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Thiophanate-methyl 70% WP is a preventive and systemic fungicide with contact action, formulated as a white-gray homogeneous fine wettable powder with specific odor. It is absorbed through the plant’s leaves and roots and provides a very good protective and curative effect against a wide range of fungal pathogens responsible of surface plant infection as eyespot, powdery mildew, blight or gray mold apple scab and other diseases of cereals, vegetables, fruit, leaf spot diseases and many diseases in floriculture. Thiophanate-methyl 70% WP can be used additionally as a wound protectant for pruning cuts on trees.Dose Foliar Spray : Spray @ 250 to 500 gm per ha. (0.5 g/lit of water). Seed Treatment : @ 2 to 3 gm/kg of Seeds. Seedling Dip : Dip the seedlings in Bond-007 suspension @ 1 - 1.5 g/lit. of Water Soil Drench : Drench the soil with Bond-007 @ 2 - 4 g/lit of water (Flower beds/Nurseries). PHT :Dipping or spraying @ 0.5 g/lit of water and drying under the shade.
Bond-007 Fungicide
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Bond-007 Fungicide
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