SOLDER FLUX SOLDER PASTE
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The quality of solder paste, excellent wetting, high reliability. Can effectively prevent the collapse of the printing and preheat, Tack lasting, easy to dry, sticky time for more than 48 hours. A colorless transparent, does not affect the test, fine-clean and cleaning performance. Products wetting, anti-dry and strong, long shelf life at room temperature Suitable for : Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc.
solder paste
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PAI SH6209 (Sn62Ag2Pb36) RMA NC Solder Paste SH-6209 PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life. SH-6209 is a Sn62Ag2Pb36 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar. High print speed (0-120 mm/sec) Excellent wettability Reflow with or without nitrogen Low void Over 8 hours stencil life Extended tack time > 12 hours Download – Technical Data Sheet
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