Soldering Pastes Dealers in Vadodara

• Type: XG-z40
• Type: Smd paste
• Alloy: Sn63/Pb37
• Microns: 25-45um
• Volume: 10cc

The quality of solder paste, excellent wetting, high reliability. Can effectively prevent the collapse of the printing and preheat, Tack lasting, easy to dry, sticky time for more than 48 hours. A colorless transparent, does not affect the test, fine-clean and cleaning performance. Products wetting, anti-dry and strong, long shelf life at room temperature Suitable for : Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc.

PAI PF606 (SAC305) NC Solder Paste     Lead-Free No Clean Solder Paste PART NO: PF606 The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAI’s lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life. PF606  is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less)  and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar. Pb < 1000 ppm, Cd < 20 ppm High print speed: 0-120 mm/sec Over 8 hours stencil life Extended tack time > 12 hours Excellent wettability Low void Download – Technical Data Sheet

solder paste, Solder Wire, PAI SP604 (SnAg0.1Cu0.5+Ni+Ge) Solder Bar

solder paint

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