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8329TCS - Thermal Adhesive, High TC
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This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8329TFS) suitable for use with mixing tips. This adhesive has been formulated to have a long working time. We also offer fast-curing alternatives with 5-minute (8329TCF), and 45-minute (8329TCM) working times. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available. Features & Benefits Thermal conductivity of 1.4 W/(m·K) 1:1 mix ratio Working time: 4 hours Cure time: 1 hour at 80 °C (176 °F) Provides strong electrical insulation High tensile strength Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons NASA low outgassing approved
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